
TANAKA Precious Metals|Bonding Wires
(Wire Size = 20 µm) Type Product Specifiions Appliion Feature; Breaking load (mN) Elongation (%) Au alloy wire (Purity of 99%) GPG: 66-99: 1.0-7.0: DIP,SIP,QFP,BGA,CSP: High reliability with 99.99% Au wires, good for fine pitch pads Applicable to halogen resin: GPG-2: 61-109: 1.0-7.0: GPH: 58-106: 1.0-7.0: High reliability with 99.99% Au